Yes, you do need a license to use ThuChip technology for 3D chip stacking applications, but don't worry, its simple.



The Kuroda Lab at Keio University has spent over a decade pioneering the use of inductive coupling for chip stacking, and the technology is covered by many patents. ThruChip Communications LLC has partnered with Keio University to proliferate this technology and ThruChip can grant a license to the needed patents.




For more information, send us an email to info@ThruChip.com.