The ThruChip Interface can be used in various applications that need low cost, low power 3D chip stacking.
Examples include:
- Stacked FLASH memory (See ISSCC 2010 paper "A 2 Gb/s 1.8pJ/b Inductive-Coupling ThruChip Bus for 128-Die NAND-Flash Memory Stacking.")
- Stacked DRAM
- Stacked FPGA
- Attaching memory on top of SoC
- Connecting through Image Sensor die
- Non-contact memory card
- Non-contact wafer level testing for known good die
- Silicon interposer