Compatible with conventional packaging approaches.
Cost and complexity are big issues with packaging.
The ThruChip Interface helps lower cost and reduces complexity by being compatible with existing packaging technolgies such as wire bonding.
When stacking several chips, such as NAND FLASH, the number of wire bonds can get excessively complex and costly.
With the ThruChip Interface, data can be communicted wireless between die, dramatically reducing the number of wire bonds.
The few remaining wire bonds would be mainly for power and ground, and can be delivered to each die with a simple staggering of each die layer.
For higher performance applications, such as stacked DRAM, the inductance of wire bonds can be a performance limiter.
Moving to a ThruChip Interface can help increase bandwidths, lower power, and reduce costs.
