Need lots of bandwidth between your stacked die?
ThruChip's TCI interface is scalable up to Terabytes per second, with very low power consumption.
See some of the results below from measured test chips.
TCI bandwidths and power improve wtih each technology generation, scaling just like digital logic.
The TCI inteface consumes constant I/O energy and delay regardless of the number of chips being stacked.
This is much better than TSV which needs to drive all of the chips that are wired together, and therefore TSV I/O power and delay is increased in proportion to the number of stacked chips.